Proceedings - International Symposium for Testing and Failure Analysis
Last updated ISSN 0890-1740
Proceedings - International Symposium for Testing and Failure Analysis is an academic journal in engineering. It is a subscription journal. Its article processing charge is not published.
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What it publishes
Recent work in Proceedings - International Symposium for Testing and Failure Analysis concentrates on these topics, taken from its published record rather than from its own description:
- Integrated Circuits and Semiconductor Failure Analysis
- Electron and X-Ray Spectroscopy Techniques
- Semiconductor materials and devices
- VLSI and Analog Circuit Testing
- Industrial Vision Systems and Defect Detection
- Force Microscopy Techniques and Applications
- Advanced Surface Polishing Techniques
- Advancements in Photolithography Techniques
- Electronic Packaging and Soldering Technologies
- Advanced Electron Microscopy Techniques and Applications
Key facts
| Publisher | Not recorded |
|---|---|
| ISSN | 0890-1740 |
| Subject area | Engineering |
| Access | Subscription |
| Article processing charge | Not published |
| Indexed in | Not recorded |
| Articles published | 2,722 |
| Publishing since | 1996 |
Facts come from OpenAlex, DOAJ and Wikidata and may lag the journal’s own pages. Check the publisher’s site before submitting. Indexing shown here is what is recorded, not a complete picture — about a third of journals have no indexing recorded anywhere we can read, so “not recorded” does not mean a journal is absent from Scopus or Web of Science.
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