Journal of Microelectronics and Electronic Packaging
Last updated ISSN 1551-4897
Journal of Microelectronics and Electronic Packaging is an academic journal in engineering. It is open access. Its article processing charge is not published.
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What it publishes
Recent work in Journal of Microelectronics and Electronic Packaging concentrates on these topics, taken from its published record rather than from its own description:
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrical and Thermal Properties of Materials
- Electromagnetic Compatibility and Noise Suppression
- Silicon Carbide Semiconductor Technologies
- Ferroelectric and Piezoelectric Materials
- Additive Manufacturing and 3D Printing Technologies
- Heat Transfer and Optimization
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor Lasers and Optical Devices
Key facts
| Publisher | Not recorded |
|---|---|
| ISSN | 1551-4897, 1555-8037 |
| Subject area | Engineering |
| Access | Open access |
| Article processing charge | Not published |
| Indexed in | Scopus |
| Articles published | 523 |
| Publishing since | 1996 |
Facts come from OpenAlex, DOAJ and Wikidata and may lag the journal’s own pages. Check the publisher’s site before submitting. Indexing shown here is what is recorded, not a complete picture — about a third of journals have no indexing recorded anywhere we can read, so “not recorded” does not mean a journal is absent from Scopus or Web of Science.
Journals like Journal of Microelectronics and Electronic Packaging
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