IMAPSource Proceedings
Last updated ISSN 2380-4505
IMAPSource Proceedings is published by International Microelectronics Assembly and Packaging Society in engineering. It is a subscription journal. Its article processing charge is not published.
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What it publishes
Recent work in IMAPSource Proceedings concentrates on these topics, taken from its published record rather than from its own description:
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Additive Manufacturing and 3D Printing Technologies
- Copper Interconnects and Reliability
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
- Semiconductor Lasers and Optical Devices
- Nanomaterials and Printing Technologies
- Manufacturing Process and Optimization
Key facts
| Publisher | International Microelectronics Assembly and Packaging Society |
|---|---|
| ISSN | 2380-4505 |
| Subject area | Engineering |
| Access | Subscription |
| Article processing charge | Not published |
| Indexed in | Not recorded |
| Articles published | 2,652 |
| Publishing since | 2000 |
| Journal website | imapsource.org |
Facts come from OpenAlex, DOAJ and Wikidata and may lag the journal’s own pages. Check the publisher’s site before submitting. Indexing shown here is what is recorded, not a complete picture — about a third of journals have no indexing recorded anywhere we can read, so “not recorded” does not mean a journal is absent from Scopus or Web of Science.
Journals like IMAPSource Proceedings
Other established journals in engineering, if this one is not the right home for your paper: