IEEE Transactions on Components and Packaging Technologies
Last updated ISSN 1521-3331
IEEE Transactions on Components and Packaging Technologies is published by Institute of Electrical and Electronics Engineers in engineering. It is a subscription journal. Its article processing charge is not published.
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What it publishes
Recent work in IEEE Transactions on Components and Packaging Technologies concentrates on these topics, taken from its published record rather than from its own description:
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Heat Transfer and Optimization
- Electrical Contact Performance and Analysis
- Adhesion, Friction, and Surface Interactions
- Heat Transfer and Boiling Studies
- Thermal properties of materials
- Integrated Circuits and Semiconductor Failure Analysis
- Silicon Carbide Semiconductor Technologies
- Ferroelectric and Negative Capacitance Devices
Key facts
| Publisher | Institute of Electrical and Electronics Engineers |
|---|---|
| ISSN | 1521-3331, 1557-9972 |
| Subject area | Engineering |
| Access | Subscription |
| Article processing charge | Not published |
| Indexed in | Scopus |
| Articles published | 1,508 |
| Publishing since | 1994 |
| Journal website | ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=614 |
Facts come from OpenAlex, DOAJ and Wikidata and may lag the journal’s own pages. Check the publisher’s site before submitting. Indexing shown here is what is recorded, not a complete picture — about a third of journals have no indexing recorded anywhere we can read, so “not recorded” does not mean a journal is absent from Scopus or Web of Science.
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