IEEE Transactions on Advanced Packaging
Last updated ISSN 1521-3323
IEEE Transactions on Advanced Packaging is published by Institute of Electrical and Electronics Engineers in engineering. It is a subscription journal. The article processing charge is $2,645.
Is your paper a fit?
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What it publishes
Recent work in IEEE Transactions on Advanced Packaging concentrates on these topics, taken from its published record rather than from its own description:
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor Lasers and Optical Devices
- Microwave Engineering and Waveguides
- Electromagnetic Simulation and Numerical Methods
- Photonic and Optical Devices
- Advanced Antenna and Metasurface Technologies
- Lightning and Electromagnetic Phenomena
- Material Properties and Processing
Key facts
| Publisher | Institute of Electrical and Electronics Engineers |
|---|---|
| ISSN | 1521-3323, 1557-9980 |
| Subject area | Engineering |
| Access | Subscription |
| Article processing charge | $2,645 |
| Indexed in | Scopus |
| Articles published | 1,310 |
| Publishing since | 1997 |
| Journal website | ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber |
Facts come from OpenAlex, DOAJ and Wikidata and may lag the journal’s own pages. Check the publisher’s site before submitting. Indexing shown here is what is recorded, not a complete picture — about a third of journals have no indexing recorded anywhere we can read, so “not recorded” does not mean a journal is absent from Scopus or Web of Science.
Journals like IEEE Transactions on Advanced Packaging
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