Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Last updated ISSN 2380-4491
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) is published by International Microelectronics Assembly and Packaging Society in engineering. It is a subscription journal. Its article processing charge is not published.
Is your paper a fit?
The surest way to know is to compare your own abstract against what this journal has actually been publishing, rather than against its aims-and-scope page. Paste your abstract and Journal Hunt will tell you how close Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) is — and show you journals like it.
What it publishes
Recent work in Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) concentrates on these topics, taken from its published record rather than from its own description:
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electrical and Thermal Properties of Materials
- Silicon Carbide Semiconductor Technologies
- Additive Manufacturing and 3D Printing Technologies
- Semiconductor materials and devices
- Ferroelectric and Piezoelectric Materials
- Advanced MEMS and NEMS Technologies
- Electromagnetic Compatibility and Noise Suppression
- Advancements in Semiconductor Devices and Circuit Design
Key facts
| Publisher | International Microelectronics Assembly and Packaging Society |
|---|---|
| ISSN | 2380-4491 |
| Subject area | Engineering |
| Access | Subscription |
| Article processing charge | Not published |
| Indexed in | Not recorded |
| Articles published | 1,342 |
| Publishing since | 2010 |
| Journal website | imapsource.org |
Facts come from OpenAlex, DOAJ and Wikidata and may lag the journal’s own pages. Check the publisher’s site before submitting. Indexing shown here is what is recorded, not a complete picture — about a third of journals have no indexing recorded anywhere we can read, so “not recorded” does not mean a journal is absent from Scopus or Web of Science.
Journals like Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Other established journals in engineering, if this one is not the right home for your paper: